XC3S700A4FGG400I Xilinx | Chip 1 Exchange

XC3S700A4FGG400I

Manufacturer: Xilinx

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

XC3S700A-4FGG400I

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

XILINX INC

Part Package Code:

BGA

Package Description:

FBGA-400

Pin Count:

400

Reach Compliance Code:

compliant

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Factory Lead Time:

12 Weeks

Manufacturer:

Xilinx

Risk Rank:

1.33

Clock Frequency-Max:

667 MHz

Combinatorial Delay of a CLB-Max:

0.71 ns

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level:

3

Number of CLBs:

1472

Number of Equivalent Gates:

700000

Number of Inputs:

311

Number of Logic Cells:

13248

Number of Outputs:

248

Number of Terminals:

400

Operating Temperature-Max:

100 °C

Operating Temperature-Min:

-40 °C

Organization:

1472 CLBS, 700000 GATES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA400,20X20,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

250

Power Supplies:

1.2,2.5/3.3 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

2.43 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.26 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Nom:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

30

Width:

21 mm

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