XC6SLX452CSG324C

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Product Technical Specifications

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

XILINX INC

Part Package Code

BGA

Package Description

15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324

Pin Count

324

Reach Compliance Code

compliant

ECCN Code

3A991.D

HTS Code

8542.39.00.01

Clock Frequency-Max

667 MHz

Combinatorial Delay of a CLB-Max

0.26 ns

JESD-30 Code

S-PBGA-B324

JESD-609 Code

Length

15 mm

Moisture Sensitivity Level

Number of CLBs

3411

Number of Inputs

218

Number of Logic Cells

43661

Number of Outputs

218

Number of Terminals

324

Operating Temperature-Max

85 °C

Operating Temperature-Min

Organization

3411 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA324,18X18,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

1.2,2.5/3.3 V

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status

Not Qualified

Seated Height-Max

1.5 mm

Supply Voltage-Max

1.26 V

Supply Voltage-Min

1.14 V

Supply Voltage-Nom

1.2 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

Width