XC6SLX92CSG225C

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Product Technical Specifications

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Part Package Code

BGA

Package Description

13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225

Pin Count

225

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.39.00.01

Clock Frequency-Max

667 MHz

Combinatorial Delay of a CLB-Max

0.26 ns

JESD-30 Code

S-PBGA-B225

JESD-609 Code

Length

13 mm

Moisture Sensitivity Level

Number of CLBs

715

Number of Inputs

160

Number of Logic Cells

9152

Number of Outputs

160

Number of Terminals

225

Operating Temperature-Max

85 °C

Operating Temperature-Min

Organization

715 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA225,15X15,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

1.2,2.5/3.3 V

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status

Not Qualified

Seated Height-Max

1.4 mm

Supply Voltage-Max

1.26 V

Supply Voltage-Min

1.14 V

Supply Voltage-Nom

1.2 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

Width