XC7K325T2FF900I

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Product Technical Specifications

Rohs Code

No

Part Life Cycle Code

Active

Package Description

FBGA-900

Reach Compliance Code

not_compliant

ECCN Code

3A991.D

HTS Code

8542.39.00.01

Clock Frequency-Max

1818 MHz

Combinatorial Delay of a CLB-Max

0.61 ns

JESD-30 Code

S-PBGA-B900

JESD-609 Code

e0

Length

31 mm

Number of CLBs

25475

Number of Inputs

500

Number of Logic Cells

326080

Number of Outputs

500

Number of Terminals

900

Operating Temperature-Max

100 °C

Operating Temperature-Min

-40 °C

Organization

25475 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA900,30X30,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

1,1.8,3.3 V

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status

Not Qualified

Seated Height-Max

3.35 mm

Supply Voltage-Max

1.03 V

Supply Voltage-Min

0.97 V

Supply Voltage-Nom

1 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Lead (Sn63Pb37)

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Width

31 mm