XC7K325T2FFG900I

No Match Found

Product Technical Specifications

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

XILINX INC

Part Package Code

BGA

Package Description

FBGA-900

Pin Count

900

Reach Compliance Code

not_compliant

ECCN Code

3A991.D

HTS Code

8542.39.00.01

Factory Lead Time

65 Weeks

Clock Frequency-Max

1818 MHz

Combinatorial Delay of a CLB-Max

0.61 ns

JESD-30 Code

S-PBGA-B900

JESD-609 Code

e1

Length

31 mm

Moisture Sensitivity Level

4

Number of CLBs

25475

Number of Inputs

500

Number of Logic Cells

326080

Number of Outputs

500

Number of Terminals

900

Operating Temperature-Max

100 °C

Operating Temperature-Min

-40 °C

Organization

25475 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA900,30X30,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

245

Power Supplies

1,1.8,3.3 V

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status

Not Qualified

Seated Height-Max

3.35 mm

Supply Voltage-Max

1.03 V

Supply Voltage-Min

0.97 V

Supply Voltage-Nom

1 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

31 mm

Alternate Parts

XC7K325T2FF900I