XC7K325T2FFG900I Xilinx | Chip 1 Exchange

XC7K325T2FFG900I

Manufacturer: Xilinx

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

XC7K325T-2FFG900I

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

XILINX INC

Part Package Code:

BGA

Package Description:

FBGA-900

Pin Count:

900

Reach Compliance Code:

not_compliant

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Factory Lead Time:

12 Weeks

Manufacturer:

Xilinx

Risk Rank:

2.34

Samacsys Description:

XILINX - XC7K325T-2FFG900I - FPGA, KINTEX-7, 400 I/O, FCBGA-900

Samacsys Manufacturer:

XILINX

Clock Frequency-Max:

1818 MHz

Combinatorial Delay of a CLB-Max:

0.61 ns

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level:

4

Number of CLBs:

25475

Number of Inputs:

500

Number of Logic Cells:

326080

Number of Outputs:

500

Number of Terminals:

900

Operating Temperature-Max:

100 °C

Operating Temperature-Min:

-40 °C

Organization:

25475 CLBS

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA900,30X30,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Power Supplies:

1,1.8,3.3 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

3.35 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.03 V

Supply Voltage-Min:

0.97 V

Supply Voltage-Nom:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

31 mm

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