XCF02SVO20C Xilinx | Chip 1 Exchange

XCF02SVO20C

Manufacturer: Xilinx

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

XCF02SVO20C

Pbfree Code:

No

Rohs Code:

No

Part Life Cycle Code:

End Of Life

Ihs Manufacturer:

XILINX INC

Part Package Code:

TSSOP

Package Description:

TSSOP, TSSOP20,.25

Pin Count:

20

Reach Compliance Code:

not_compliant

ECCN Code:

EAR99

HTS Code:

8542.32.00.51

Factory Lead Time:

12 Weeks

Manufacturer:

Xilinx

Risk Rank:

6.37

Additional Feature:

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

Data Retention Time-Min:

20

Endurance:

20000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

6.5024 mm

Memory Density:

2097152 bit

Memory IC Type:

CONFIGURATION MEMORY

Memory Width:

1

Moisture Sensitivity Level:

3

Number of Functions:

1

Number of Terminals:

20

Number of Words:

2097152 words

Number of Words Code:

2000000

Operating Mode:

SYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

2MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

TSSOP

Package Equivalence Code:

TSSOP20,.25

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel/Serial:

SERIAL

Peak Reflow Temperature (Cel):

225

Power Supplies:

1.8/3.3,3.3 V

Qualification Status:

Not Qualified

Seated Height-Max:

1.19 mm

Standby Current-Max:

0.001 A

Subcategory:

Flash Memories

Supply Current-Max:

0.01 mA

Supply Voltage-Max (Vsup):

3.6 V

Supply Voltage-Min (Vsup):

3 V

Supply Voltage-Nom (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

GULL WING

Terminal Pitch:

0.65 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

30

Type:

NOR TYPE

Width:

4.4 mm

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