XCF04S-VOG20C Xilinx | Chip 1 Exchange

XCF04S-VOG20C

Manufacturer: Xilinx

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

XCF04SVOG20C0936

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

XILINX INC

Part Package Code:

TSSOP

Package Description:

TSSOP,

Pin Count:

20

Reach Compliance Code:

compliant

ECCN Code:

3A991.B.1.B.1

HTS Code:

8542.32.00.51

Manufacturer:

Xilinx

Risk Rank:

5.67

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5024 mm

Memory Density:

4194304 bit

Memory IC Type:

CONFIGURATION MEMORY

Memory Width:

1

Moisture Sensitivity Level:

3

Number of Functions:

1

Number of Terminals:

20

Number of Words:

4194304 words

Number of Words Code:

4000000

Operating Mode:

SYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

4MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

TSSOP

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel/Serial:

SERIAL

Peak Reflow Temperature (Cel):

260

Qualification Status:

Not Qualified

Seated Height-Max:

1.19 mm

Supply Voltage-Max (Vsup):

3.6 V

Supply Voltage-Min (Vsup):

3 V

Supply Voltage-Nom (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

0.65 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

30

Width:

4.4 mm

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