XCF32PFS48C

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Product Technical Specifications

Pbfree Code

Rohs Code

Part Life Cycle Code

Obsolete

Ihs Manufacturer

XILINX INC

Part Package Code

BGA

Package Description

PLASTIC, TFBGA-48

Pin Count

Reach Compliance Code

not_compliant

ECCN Code

3A991.B.1.A

HTS Code

8542.32.00.51

Additional Feature

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

Data Retention Time-Min

Endurance

20000 Write/Erase Cycles

JESD-30 Code

R-PBGA-B48

JESD-609 Code

Length

9 mm

Memory Density

33554432 bit

Memory IC Type

CONFIGURATION MEMORY

Memory Width

Moisture Sensitivity Level

Number of Functions

Number of Terminals

Number of Words

33554432 words

Number of Words Code

32000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

32MX1

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

BGA48,6X8,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel/Serial

SERIAL

Peak Reflow Temperature (Cel)

240

Power Supplies

1.5/3.3,1.8 V

Qualification Status

Not Qualified

Seated Height-Max

1.2 mm

Supply Current-Max

0.04 mA

Supply Voltage-Max (Vsup)

2 V

Supply Voltage-Min (Vsup)

1.65 V

Supply Voltage-Nom (Vsup)

1.8 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN LEAD

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

Type

NOR TYPE

Width

8 mm

Cart