XCF32PFSG48C

Manufacturer: AMD Xilinx

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

XCF32PFSG48C

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

XILINX INC

Part Package Code:

BGA

Package Description:

LEAD-FREE, PLASTIC, TFBGA-48

Pin Count:

48

Reach Compliance Code:

compliant

ECCN Code:

3A991.B.1.A

HTS Code:

8542.32.00.51

Manufacturer:

AMD Xilinx

Risk Rank:

7.67

Additional Feature:

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

Clock Frequency-Max (fCLK):

50 MHz

Data Retention Time-Min:

20

Endurance:

20000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e2

Length:

9 mm

Memory Density:

33554432 bit

Memory IC Type:

CONFIGURATION MEMORY

Memory Width:

1

Moisture Sensitivity Level:

3

Number of Functions:

1

Number of Terminals:

48

Number of Words:

33554432 words

Number of Words Code:

32000000

Operating Mode:

SYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

32MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

TFBGA

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

RECTANGULAR

Package Style:

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel/Serial:

SERIAL

Peak Reflow Temperature (Cel):

260

Power Supplies:

1.5/3.3,1.8 V

Programming Voltage:

1.8 V

Qualification Status:

Not Qualified

Seated Height-Max:

1.2 mm

Subcategory:

Flash Memories

Supply Current-Max:

0.04 mA

Supply Voltage-Max (Vsup):

2 V

Supply Voltage-Min (Vsup):

1.65 V

Supply Voltage-Nom (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Terminal Form:

BALL

Terminal Pitch:

0.8 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

30

Type:

NOR TYPE

Width:

8 mm

Write Protection:

HARDWARE

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Alternate Parts

XCF32PFS48C