DSPIC33EP512MU810IPF

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Product Technical Specifications

Source Content uid

DSPIC33EP512MU810I/PF

Part Life Cycle Code

Active

Part Package Code

QFP

Package Description

14 X 14 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-100

Pin Count

100

Reach Compliance Code

unknown

Has ADC

YES

Address Bus Width

16

Bit Size

16

Clock Frequency-Max

40 MHz

DAC Channels

NO

DMA Channels

YES

External Data Bus Width

16

JESD-30 Code

S-PQFP-G100

JESD-609 Code

e3

Length

14 mm

Number of I/O Lines

83

Number of Terminals

100

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

TFQFP

Package Shape

SQUARE

Package Style

FLATPACK, THIN PROFILE, FINE PITCH

Qualification Status

Not Qualified

ROM Programmability

FLASH

Seated Height-Max

1.2 mm

Speed

60 MHz

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

MATTE TIN

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Width

14 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

Alternate Parts

DSPIC33EP512MU810EPF

DSPIC33EP512MU810EPT

DSPIC33EP512MU810TIPF