MC68HC11E1CFNE3

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Product Technical Specifications

Source Content uid

MC68HC11E1CFNE3

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

QCCJ,

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Date Of Intro

1988-01-01

Has ADC

YES

Additional Feature

SEATED HT-CALCULATED

Address Bus Width

16

Bit Size

8

Clock Frequency-Max

12 MHz

DAC Channels

NO

DMA Channels

NO

External Data Bus Width

8

JESD-30 Code

S-PQCC-J52

JESD-609 Code

e3

Length

19.125 mm

Moisture Sensitivity Level

3

Number of I/O Lines

38

Number of Terminals

52

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

NO

Package Body Material

PLASTIC/EPOXY

Package Code

QCCJ

Package Shape

SQUARE

Package Style

CHIP CARRIER

Peak Reflow Temperature (Cel)

260

Seated Height-Max

5.08 mm

Speed

3 MHz

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

Surface Mount

YES

Technology

HCMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN

Terminal Form

J BEND

Terminal Pitch

1.27 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

40

Width

19.125 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

Alternate Parts

MC68HC11E1CFNE3R

NXPMC68HC11E1CFNE3

MC68HC11E1CFNE3