MCF5272VM66

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Product Technical Specifications

Source Content uid

MCF5272VM66

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

BGA,

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Address Bus Width

23

Bit Size

32

Boundary Scan

YES

Clock Frequency-Max

66 MHz

External Data Bus Width

32

Format

FIXED POINT

Integrated Cache

YES

JESD-30 Code

S-PBGA-B196

JESD-609 Code

e1

Length

15 mm

Low Power Mode

YES

Moisture Sensitivity Level

3

Number of Terminals

196

Operating Temperature-Max

70 °C

Operating Temperature-Min

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

260

Qualification Status

Not Qualified

Seated Height-Max

1.75 mm

Speed

66 MHz

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

COMMERCIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Width

15 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Alternate Parts

MCF5272VM66

MSM9841G32K